Invention Grant
- Patent Title: Molded embedded bridge including routing layers for enhanced EMIB applications
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Application No.: US17096781Application Date: 2020-11-12
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Publication No.: US11600563B2Publication Date: 2023-03-07
- Inventor: Srinivas Venkata Ramanuja Pietambaram , Rahul N. Manepalli
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L23/538 ; H01L21/56 ; H01L23/31 ; H01L23/48 ; H01L23/00 ; H01L25/065
Abstract:
Disclosed is an embedded multi-die interconnect bridge (EMIB) substrate. The EMIB substrate can comprise an organic substrate, a bridge embedded in the organic substrate and a plurality of routing layers. The plurality of routing layers can be embedded within the bridge. Each routing layer can have a plurality of traces. Each of the plurality of routing layers can have a coefficient of thermal expansion (CTE) that varies from an adjacent routing layer.
Public/Granted literature
- US20210066190A1 MOLDED EMBEDDED BRIDGE FOR ENHANCED EMIB APPLICATIONS Public/Granted day:2021-03-04
Information query
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