Invention Grant
- Patent Title: Textured bond pads
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Application No.: US17356302Application Date: 2021-06-23
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Publication No.: US11600583B2Publication Date: 2023-03-07
- Inventor: Rafael Jose Lizares Guevara , Aniceto Tabangcura Rabilas, Jr. , Ray Fredric Solis de Asis , Sylvester Tigno Sanchez , Alvin Lopez Andaya
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Ronald O. Neerings; Frank D. Cimino
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/56 ; H01L23/495
Abstract:
In some examples, a package comprises a semiconductor die and a bond pad formed upon the semiconductor die. The bond pad has a protrusion on a top surface of the bond pad. The package also comprises a metal contact and a bond wire coupled to the protrusion and to the metal contact.
Public/Granted literature
- US20210320074A1 Textured Bond Pads Public/Granted day:2021-10-14
Information query
IPC分类:
