Invention Grant
- Patent Title: Chip, circuit board and electronic device
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Application No.: US17208383Application Date: 2021-03-22
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Publication No.: US11600584B2Publication Date: 2023-03-07
- Inventor: Jinfu Zhang , Yunjun Hua
- Applicant: Beijing Xiaomi Mobile Software Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: Beijing Xiaomi Mobile Software Co., Ltd.
- Current Assignee: Beijing Xiaomi Mobile Software Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: CN202020412004.1 20200326,CN202010653932.1 20200708
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/00

Abstract:
A chip includes: a chip substrate including a central area and an edge area surrounding the central area; and a plurality of pads arranged on the chip substrate, the plurality of pads including a first pad and a second pad, wherein the first pad is arranged in the edge area and includes at least one straight side adjacent to a side of the chip substrate, and the second pad is arranged in the central area.
Public/Granted literature
- US20210305184A1 CHIP, CIRCUIT BOARD AND ELECTRONIC DEVICE Public/Granted day:2021-09-30
Information query
IPC分类: