Invention Grant
- Patent Title: Switch chip with bond wires replacing traces in a die
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Application No.: US17234310Application Date: 2021-04-19
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Publication No.: US11600612B2Publication Date: 2023-03-07
- Inventor: Didmin Shih , Tengyi Huang , Ting-Yen Wang , Yen Wei Wu
- Applicant: VIA LABS, INC.
- Applicant Address: TW New Taipei
- Assignee: VIA LABS, INC.
- Current Assignee: VIA LABS, INC.
- Current Assignee Address: TW New Taipei
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW110108662 20210311
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H02H9/04 ; H01L23/52
Abstract:
A switch chip includes a first switch device, a first ESD protection device and a second ESD protection device. The first switch device is electrically coupled between a first pad and a second pad. The first ESD protection device is electrically coupled to a third pad which is electrically coupled to the first pad by a first bond wire. The second ESD protection device is electrically coupled to a fourth pad which is electrically coupled to the second pad by a second bond wire.
Public/Granted literature
- US20220199612A1 SWITCH CHIP WITH BOND WIRES REPLACING TRACES IN A DIE Public/Granted day:2022-06-23
Information query
IPC分类:
