Invention Grant
- Patent Title: Microwave integrated circuits including gallium-nitride devices on silicon
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Application No.: US17213900Application Date: 2021-03-26
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Publication No.: US11600614B2Publication Date: 2023-03-07
- Inventor: Douglas Carlson , Timothy E. Boles , Wayne Mack Struble
- Applicant: MACOM Technology Solutions Holdings, Inc.
- Applicant Address: US MA Lowell
- Assignee: MACOM Technology Solutions Holdings, Inc.
- Current Assignee: MACOM Technology Solutions Holdings, Inc.
- Current Assignee Address: US MA Lowell
- Agency: Perilla Knox & Hildebrandt LLP
- Agent Jason M. Perilla
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L21/8258 ; H01L23/66 ; H01L21/762

Abstract:
Various integrated circuits formed using gallium nitride and other materials are described. In one example, an integrated circuit includes a first integrated device formed over a first semiconductor structure in a first region of the integrated circuit, a second integrated device formed over a second semiconductor structure in a second region of the integrated circuit, and a passive component formed over a third region of the integrated circuit, between the first region and the second region. The third region comprises an insulating material, which can be glass in some cases. Further, the passive component can be formed over the glass in the third region. The integrated circuit is designed to avoid electromagnetic coupling between the passive component, during operation of the integrated circuit, and interfacial parasitic conductive layers existing in the first and second semiconductor structures, to improve performance.
Public/Granted literature
- US20210305239A1 MICROWAVE INTEGRATED CIRCUITS INCLUDING GALLIUM-NITRIDE DEVICES ON SILICON Public/Granted day:2021-09-30
Information query
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