Invention Grant
- Patent Title: Apparatuses and packages including a semiconductor substrate with a plurality of photoelectronic conversion regions and a transparent substrate
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Application No.: US17314151Application Date: 2021-05-07
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Publication No.: US11600648B2Publication Date: 2023-03-07
- Inventor: Takaaki Hirano , Shinji Miyazawa , Kensaku Maeda , Yusuke Moriya , Shunsuke Furuse , Yutaka Ooka
- Applicant: SONY GROUP CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY GROUP CORPORATION
- Current Assignee: SONY GROUP CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2013-054587 20130318
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H04N5/374
Abstract:
Provided is a semiconductor device including: a multilayer substrate including an optical element; a light-transmitting plate provided on the substrate to cover the optical element; and a lens of an inorganic material provided between the substrate and the light-transmitting plate. A structure having a same strength as a strength per unit area of the lens is provided at a portion outside an effective photosensitive region where the optical element is formed, when the substrate is viewed in plan.
Public/Granted literature
- US20210265407A1 SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS Public/Granted day:2021-08-26
Information query
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