- Patent Title: Nitride semiconductor laminate, semiconductor device, method of manufacturing nitride semiconductor laminate, method of manufacturing nitride semiconductor free-standing substrate and method of manufacturing semiconductor device
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Application No.: US16621605Application Date: 2018-04-19
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Publication No.: US11600704B2Publication Date: 2023-03-07
- Inventor: Hajime Fujikura
- Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
- Applicant Address: JP Tokyo
- Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
- Current Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JPJP2017-117658 20170615
- International Application: PCT/JP2018/016130 WO 20180419
- International Announcement: WO2018/230150 WO 20181220
- Main IPC: H01L29/36
- IPC: H01L29/36 ; H01L29/20 ; C30B25/18 ; C30B25/20 ; C30B29/40 ; C30B31/22 ; H01L21/02 ; H01L21/265 ; H01L21/266 ; H01L21/324 ; H01L29/66 ; H01L29/872

Abstract:
A nitride semiconductor laminate includes: a substrate comprising a group III nitride semiconductor and including a surface and a reverse surface, the surface being formed from a nitrogen-polar surface, the reverse surface being formed from a group III element-polar surface and being provided on the reverse side from the surface; a protective layer provided at least on the reverse surface side of the substrate and having higher heat resistance than the reverse surface of the substrate; and a semiconductor layer provided on the surface side of the substrate and comprising a group III nitride semiconductor. The concentration of O in the semiconductor layer is lower than 1×1017 at/cm3.
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