Invention Grant
- Patent Title: Semiconductor device having buried gate structure and method for fabricating the same
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Application No.: US17365078Application Date: 2021-07-01
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Publication No.: US11600710B2Publication Date: 2023-03-07
- Inventor: Dong-Soo Kim
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2019-0071525 20190617
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/78 ; H01L29/49 ; H01L27/108 ; H01L29/51

Abstract:
Disclosed is a semiconductor device for improving a gate induced drain leakage and a method for fabricating the same, and the semiconductor device includes a substrate, a first doped region and a second doped region formed to be spaced apart from each other by a trench in the substrate, a first gate dielectric layer over the trench, a lower gate over the first gate dielectric layer, an upper gate over the lower gate and having a smaller width than the lower gate, and a second gate dielectric layer between the upper gate and the first gate dielectric layer.
Public/Granted literature
- US20210328033A1 SEMICONDUCTOR DEVICE HAVING BURIED GATE STRUCTURE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2021-10-21
Information query
IPC分类: