Invention Grant
- Patent Title: Bipolar junction device
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Application No.: US17706346Application Date: 2022-03-28
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Publication No.: US11600719B2Publication Date: 2023-03-07
- Inventor: Zi-Ang Su , Ming-Shuan Li , Chih Chieh Yeh
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L29/737
- IPC: H01L29/737 ; H01L29/73 ; H01L29/06 ; H01L29/167 ; H01L29/10 ; H01L29/165

Abstract:
The present disclosure provides embodiments of bipolar junction transistor (BJT) structures. A BJT according to the present disclosure includes a first epitaxial feature disposed over a well region, a second epitaxial feature disposed over the well region, a vertical stack of channel members each extending lengthwise between the first epitaxial feature and the second epitaxial feature, a gate structure wrapping around each of the vertical stack of channel members, a first electrode coupled to the well region, an emitter electrode disposed over and coupled to the first epitaxial feature, and a second electrode disposed over and coupled to the second epitaxial feature.
Public/Granted literature
- US20220216330A1 BIPOLAR JUNCTION DEVICE Public/Granted day:2022-07-07
Information query
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