- Patent Title: Nitride semiconductor apparatus and manufacturing method thereof
-
Application No.: US16913375Application Date: 2020-06-26
-
Publication No.: US11600721B2Publication Date: 2023-03-07
- Inventor: Hirotaka Otake
- Applicant: ROHM Co., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM Co., LTD.
- Current Assignee: ROHM Co., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Chip Law Group
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/47 ; H01L29/205 ; H01L29/06 ; H01L29/423 ; H01L29/66 ; H01L29/40 ; H01L29/20

Abstract:
Disclosed is a nitride semiconductor apparatus including a substrate, a first nitride semiconductor layer disposed above the substrate, and constituting an electron transit layer, a second nitride semiconductor layer formed on the first nitride semiconductor layer, and constituting an electron supply layer, a nitride semiconductor gate layer disposed on the second nitride semiconductor layer having a ridge portion at at least an area thereof, and containing an acceptor-type impurity, a gate electrode disposed on the ridge portion, a source electrode and a drain electrode disposed opposite to each other, with the ridge portion interposed therebetween, on the second nitride semiconductor layer, and a strip-shaped insulator disposed between the substrate and a surface layer portion of the first nitride semiconductor layer, and extending along a length direction of the ridge portion when viewed in plan.
Public/Granted literature
- US20210005741A1 NITRIDE SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-01-07
Information query
IPC分类: