Invention Grant
- Patent Title: Transistor device and method of fabricating a gate of a transistor device
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Application No.: US17163744Application Date: 2021-02-01
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Publication No.: US11600723B2Publication Date: 2023-03-07
- Inventor: Ingmar Neumann , Michael Hutzler , David Laforet , Roland Moennich , Ralf Siemieniec
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: EP20155979 20200206
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/40 ; H01L29/66 ; H01L29/06 ; H01L29/423 ; H01L21/8234 ; H01L29/49

Abstract:
In an embodiment, a transistor device includes a semiconductor substrate having a main surface, a cell field including a plurality of transistor cells, and an edge termination region laterally surrounding the cell field. The cell field includes a gate trench in the main surface of the semiconductor substrate, a gate dielectric lining the gate trench, a metal gate electrode arranged in the gate trench on the gate dielectric, and an electrically insulating cap arranged on the metal gate electrode and within the gate trench.
Public/Granted literature
- US20210249534A1 TRANSISTOR DEVICE AND METHOD OF FABRICATING A GATE OF A TRANSISTOR DEVICE Public/Granted day:2021-08-12
Information query
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