Invention Grant
- Patent Title: Germanium-based sensor with junction-gate field effect transistor and method of fabricating thereof
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Application No.: US17383687Application Date: 2021-07-23
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Publication No.: US11600737B2Publication Date: 2023-03-07
- Inventor: Jhy-Jyi Sze , Sin-Yi Jiang , Yi-Shin Chu , Yin-Kai Liao , Hsiang-Lin Chen , Kuan-Chieh Huang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L31/112
- IPC: H01L31/112 ; H01L31/18 ; H01L27/146 ; H01L29/808

Abstract:
Germanium-based sensors are disclosed herein. An exemplary germanium-based sensor includes a germanium photodiode and a junction field effect transistor (JFET) formed from a germanium layer disposed in a silicon substrate, in some embodiments, or on a silicon substrate, in some embodiments. A doped silicon layer, which can be formed by in-situ doping epitaxially grown silicon, is disposed between the germanium layer and the silicon substrate. In embodiments where the germanium layer is on the silicon substrate, the doped silicon layer is disposed between the germanium layer and an oxide layer. The JFET has a doped polysilicon gate, and in some embodiments, a gate diffusion region is disposed in the germanium layer under the doped polysilicon gate. In some embodiments, a pinned photodiode passivation layer is disposed in the germanium layer. In some embodiments, a pair of doped regions in the germanium layer is configured as an e-lens of the germanium-based sensor.
Public/Granted literature
- US20220302336A1 Germanium-Based Sensor with Junction-Gate Field Effect Transistor and Method of Fabricating Thereof Public/Granted day:2022-09-22
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