Invention Grant
- Patent Title: Release layer for preparation of ion-conducting membranes
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Application No.: US17131226Application Date: 2020-12-22
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Publication No.: US11600849B2Publication Date: 2023-03-07
- Inventor: Robert D. Miller , Young-Hye Na , Sogol Teschler , Khanh Nguyen
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: CanaanLaw, P.C.
- Agent Karen Canaan
- Main IPC: H01M50/403
- IPC: H01M50/403 ; H01M10/0525 ; H01M50/446 ; B29C39/36 ; B29K23/00 ; B29L31/34 ; B29K79/00 ; H01M12/08 ; H01M10/0562

Abstract:
A method includes applying to a substrate a solution including a polymeric compound to form a release layer on the substrate; applying ion-conducting elements on the release layer; applying a matrix polymer on the release layer, wherein the matrix polymer surrounds at least some of the ion-conducting elements; and removing the release layer to separate the matrix polymer from the substrate such that the ion-conducting elements remain embedded in a carrier layer of the matrix polymer and form an ion-conducting membrane.
Public/Granted literature
- US20210111462A1 RELEASE LAYER FOR PREPARATION OF ION-CONDUCTING MEMBRANES Public/Granted day:2021-04-15
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