Invention Grant
- Patent Title: Connector with built-in substrate and method of manufacturing chain terminal of the connector with built-in substrate
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Application No.: US17406234Application Date: 2021-08-19
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Publication No.: US11600940B2Publication Date: 2023-03-07
- Inventor: Ryota Ando , Hinata Hayashi , Masashi Tsukamoto , Nobuhiko Suzuki
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2020-139817 20200821
- Main IPC: H01R13/40
- IPC: H01R13/40 ; H01R13/405 ; H01R13/66 ; H01R12/55 ; H01R13/502 ; H01R43/24
Abstract:
A connector with a built-in substrate includes a chain terminal including a chain portion, a first tab portion configured to protrude from the chain portion in a predetermined direction, a second tab portion configured to protrude from the chain portion in a direction different from a protrusion direction of the first tab portion; an inner housing in which the chain terminal is installed such that the first tab portion and the second tab portion protrude; and a substrate connected to the second tab portion protruding from the inner housing.
Public/Granted literature
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