Invention Grant
- Patent Title: Wire harness routing method, wire harness routing structure, and wire harness protector
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Application No.: US17572572Application Date: 2022-01-10
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Publication No.: US11600975B2Publication Date: 2023-03-07
- Inventor: Tatsuya Tokuda , Takuya Karaki
- Applicant: YAZAKI CORPORATION
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kenealy Vaidya LLP
- Priority: JPJP2021-002958 20210112
- Main IPC: H02G1/00
- IPC: H02G1/00 ; H02G3/04 ; B60R16/02 ; H01B13/012

Abstract:
A wire harness routing method is provided. A wire harness is routed on a protector base. A protective tape is wound around an outer periphery of the wire harness at a position outside an end portion of the protector base in a longitudinal direction. A cover is put on the protector base under the above state. The wire harness is fixed to, by winding a binding band at a position where the tape is wound, a wire harness-fixed protruding piece protruding outward in the longitudinal direction from an end portion of the cover in the longitudinal direction.
Public/Granted literature
- US20220224089A1 WIRE HARNESS ROUTING METHOD, WIRE HARNESS ROUTING STRUCTURE, AND WIRE HARNESS PROTECTOR Public/Granted day:2022-07-14
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