Invention Grant
- Patent Title: Resin structure and wire harness
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Application No.: US17494516Application Date: 2021-10-05
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Publication No.: US11600978B2Publication Date: 2023-03-07
- Inventor: Kei Tomita , Kengo Ishida , Yukihiro Koyama
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2020-172003 20201012
- Main IPC: H02G3/14
- IPC: H02G3/14 ; H02G3/08 ; B60R16/02 ; H01B7/00 ; B60R16/023

Abstract:
A resin structure has an insertion portion through which an electric wire runs. The resin structure includes a first resin body and a second resin body to be attached to the first resin body in an attaching direction so as to cover the opening portion. The first resin body includes a first wall portion forming a part of a wall portion perpendicular to the attaching direction, and a first insertion portion provided in the first wall portion and forming a part of the insertion portion. The second resin body includes a second wall portion forming another part of the wall portion, and a second insertion portion provided in the second wall portion and forming another portion of the insertion portion. When the first resin body and the second resin body are attached to each other, the insertion portion is disposed in the wall portion of the resin structure.
Public/Granted literature
- US20220115850A1 RESIN STRUCTURE AND WIRE HARNESS Public/Granted day:2022-04-14
Information query
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