Certain aspects of the present disclosure generally relate to a connection terminal pattern and layout for a three-level buck regulator. One example electronic module generally includes a substrate, an integrated circuit (IC) package disposed on the substrate and comprising transistors of a three-level buck regulator, a capacitive element of the three-level buck regulator disposed on the substrate, and an inductive element of the three-level buck regulator disposed on the substrate. In certain aspects, the capacitive element and the inductive element may be disposed adjacent to different sides of the IC package.