Invention Grant
- Patent Title: Thin-film bulk acoustic resonator and semiconductor apparatus comprising the same
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Application No.: US16868373Application Date: 2020-05-06
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Publication No.: US11601106B2Publication Date: 2023-03-07
- Inventor: Herb He Huang , Clifford Ian Drowley , Jiguang Zhu , Halting Li
- Applicant: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION , NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Applicant Address: CN Shanghai; CN Ningbo
- Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION,NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Current Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION,NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Current Assignee Address: CN Shanghai; CN Ningbo
- Agency: Anova Law Group, PLLC
- Priority: CN201610135996.6 20160310
- Main IPC: H03H3/02
- IPC: H03H3/02 ; H03H9/17 ; H03H9/05 ; H03H9/58 ; H03H9/10 ; H01L27/20 ; H03H3/007 ; H03H9/02 ; H03H9/15

Abstract:
A thin-film bulk acoustic resonator (FBAR) apparatus includes a lower dielectric layer including a first cavity; an upper dielectric layer including a second cavity, wherein the upper dielectric layer is on the lower dielectric layer; and an acoustic resonance film that is positioned between and separating the first and the second cavities. The acoustic resonance film includes a lower electrode layer, an upper electrode layer, and a piezoelectric film that is sandwiched between the lower and upper electrode layers. A plan view of the first and the second cavities overlap to form an overlapped region having a polygonal shape without parallel sides.
Public/Granted literature
- US20200266790A1 THIN-FILM BULK ACOUSTIC RESONATOR AND SEMICONDUCTOR APPARATUS COMPRISING THE SAME Public/Granted day:2020-08-20
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