Invention Grant
- Patent Title: Multi-chip integrated circuit and interactive communication method for the same
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Application No.: US17405886Application Date: 2021-08-18
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Publication No.: US11601154B2Publication Date: 2023-03-07
- Inventor: Chuanxin Wu , Qinfen Hu
- Applicant: SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Applicant Address: CN Zhejiang
- Assignee: SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Current Assignee: SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Current Assignee Address: CN Zhejiang
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: CN202010849531.3 20200821
- Main IPC: H04B1/40
- IPC: H04B1/40 ; H01M10/42 ; H01M10/48

Abstract:
A multi-chip integrated circuit and an interactive communication method for the multi-chip integrated circuit are provided. The multi-chip integrated circuit includes multiple low-voltage chips connected in series with each other instead of an ultra-high voltage chip, to reduce requirements on technology for the chip. In addition, the multiple chips communicate with each other through internal communication ports based on a differential signal, to enhance reliability of communication. Two adjacent chips are connected in series and a low-voltage power supply is arranged, so that a voltage difference between communication ports of the two adjacent chips is small.
Public/Granted literature
- US20220060212A1 Multi-Chip Integrated Circuit and Interactive Communication Method for the Same Public/Granted day:2022-02-24
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