Invention Grant
- Patent Title: Array camera module having height difference, circuit board assembly and manufacturing method therefor, and electronic device
-
Application No.: US17404633Application Date: 2021-08-17
-
Publication No.: US11601576B2Publication Date: 2023-03-07
- Inventor: Mingzhu Wang , Takehiko Tanaka , Zhenyu Chen , Nan Guo , Bojie Zhao , Zhewen Mei
- Applicant: NINGBO SUNNY OPOTECH CO., LTD.
- Applicant Address: CN Zhejiang
- Assignee: NINGBO SUNNY OPOTECH CO., LTD.
- Current Assignee: NINGBO SUNNY OPOTECH CO., LTD.
- Current Assignee Address: CN Zhejiang
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: CN201611184470.3 20161220
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H04N5/247

Abstract:
An array camera module having a height difference, a circuit board assembly and a manufacturing method therefor, and an electronic device. The array camera module comprises a first camera module unit and a second camera module unit, wherein the first camera module unit comprises at least one first photosensitive assembly and at least one first lens; the first lens is located on a photosensitive path of the first photosensitive assembly; the first photosensitive assembly comprises at least one extension portion; the extension portion at least partially extends towards the direction away from the first photosensitive assembly; and the second camera module unit is fixedly connected to a second extension portion, so that the ends of the two camera module units are consistent.
Public/Granted literature
Information query