Invention Grant
- Patent Title: Headphone alignment systems and methods
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Application No.: US17338489Application Date: 2021-06-03
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Publication No.: US11601744B2Publication Date: 2023-03-07
- Inventor: Wensen Liu
- Applicant: SYNAPTICS INCORPORATED
- Applicant Address: US CA San Jose
- Assignee: SYNAPTICS INCORPORATED
- Current Assignee: SYNAPTICS INCORPORATED
- Current Assignee Address: US CA San Jose
- Agency: Paradice & Li LLP
- Main IPC: H04R1/10
- IPC: H04R1/10

Abstract:
An on-ear headphone includes an alignment structure extending into the user's concha to help the user to align the headset for optimal comfort and sound perception. The alignment minimizes sound leakage, optimizes audio playback, and improves active noise cancelation.
Public/Granted literature
- US20210400368A1 HEADPHONE ALIGNMENT SYSTEMS AND METHODS Public/Granted day:2021-12-23
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