Invention Grant
- Patent Title: Techniques for bandwidth part hopping over multiple component carriers in wireless communications
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Application No.: US17244575Application Date: 2021-04-29
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Publication No.: US11601943B2Publication Date: 2023-03-07
- Inventor: Iyab Issam Sakhnini , Tao Luo , Juan Montojo , Qiang Wu , Wanshi Chen , Wooseok Nam , Mahmoud Taherzadeh Boroujeni , Linhai He , Hwan Joon Kwon , Peter Pui Lok Ang
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Arent Fox LLP
- Main IPC: H04W72/04
- IPC: H04W72/04 ; H04W72/0453 ; H04L1/1867 ; H04L5/00
Abstract:
Aspects described herein relate to receiving or determining an indication of multiple component carriers (CCs) configured wireless communications, communicating in a first bandwidth part (BWP) within a first one of the multiple CCs during a first time period, and communicating, based on a hopping pattern, in a second BWP within a second one of the multiple CCs during a second time period.
Public/Granted literature
- US20210345328A1 TECHNIQUES FOR BANDWIDTH PART HOPPING OVER MULTIPLE COMPONENT CARRIERS IN WIRELESS COMMUNICATIONS Public/Granted day:2021-11-04
Information query
