Invention Grant
- Patent Title: Flexible printed circuit board and wiring module
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Application No.: US17275908Application Date: 2019-09-11
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Publication No.: US11602050B2Publication Date: 2023-03-07
- Inventor: Hideo Takahashi , Shinichi Takase , Hideaki Nakajima
- Applicant: AUTONETWORKS TECHNOLOGIES, LTD. , SUMITOMO WIRING SYSTEMS, LTD. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Mie; JP Mie; JP Osaka
- Assignee: AUTONETWORKS TECHNOLOGIES, LTD.,SUMITOMO WIRING SYSTEMS, LTD.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: AUTONETWORKS TECHNOLOGIES, LTD.,SUMITOMO WIRING SYSTEMS, LTD.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Mie; JP Mie; JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JPJP2018-187562 20181002
- International Application: PCT/JP2019/035664 WO 20190911
- International Announcement: WO2020/071069 WO 20200409
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/18 ; H01M50/502 ; H05K1/02 ; H01M50/50 ; H01M50/209

Abstract:
A flexible printed circuit board includes: a proximal end portion; a left strip portion and a right strip portion that extend in the rear direction from the proximal end portion; and conductive paths, a portion of which is provided spanning from the proximal end portion to the left strip portion, and another portion of which is provided spanning from the proximal end portion to the right strip portion. In portions of the conductive path in the left strip portion and the right strip portion, strip side connecting portions that are electrically connected to electrode terminals of electricity storage devices are provided. In the left strip portion, a deformation portion that deforms to increase the distance between the left strip portion and the right strip portion is provided.
Public/Granted literature
- US20210267057A1 FLEXIBLE PRINTED CIRCUIT BOARD AND WIRING MODULE Public/Granted day:2021-08-26
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