Invention Grant
- Patent Title: Circuit board and method for manufacturing the same
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Application No.: US17138786Application Date: 2020-12-30
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Publication No.: US11602054B2Publication Date: 2023-03-07
- Inventor: Lixiang Huang , Zedong Wang , Hua Miao
- Applicant: SHENNAN CIRCUITS CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: SHENNAN CIRCUITS CO., LTD.
- Current Assignee: SHENNAN CIRCUITS CO., LTD.
- Current Assignee Address: CN Shenzhen
- Priority: CN202010645387.1 20200707
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/30 ; H05K3/10 ; H05K1/02
Abstract:
The present disclosure provides a circuit board and a method for manufacturing the circuit board. The circuit board may include: a base board, an embedded component, and an attached component. The base board may define a groove, the embedded component can be disposed in the groove. The attached component can be attached to at least one surface of the base board and connected to the embedded component.
Public/Granted literature
- US20220015241A1 CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2022-01-13
Information query
