Invention Grant
- Patent Title: Backplane and method for producing same
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Application No.: US17047791Application Date: 2019-04-15
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Publication No.: US11602067B2Publication Date: 2023-03-07
- Inventor: Joachim Seidl
- Applicant: Siemens Aktiengesellschaft
- Applicant Address: DE Munich
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DE Munich
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: EP18169231 20180425
- International Application: PCT/EP2019/059615 WO 20190415
- International Announcement: WO2019/206700 WO 20191031
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K7/14 ; H02B1/015 ; H05K1/02 ; H05K3/46
Abstract:
A backplane is for electrically connecting electrical components and a method is for producing a backplane. The backplane includes a base board, conducting tracks arranged on and/or in the base board, and at least one actuator unit arranged on or in the base board.
Public/Granted literature
- US20210168962A1 BACKPLANE AND METHOD FOR PRODUCING SAME Public/Granted day:2021-06-03
Information query
