Invention Grant
- Patent Title: Double-sided hybrid cooling of PCB embedded power electronics and capacitors
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Application No.: US17165602Application Date: 2021-02-02
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Publication No.: US11602087B2Publication Date: 2023-03-07
- Inventor: Feng Zhou , Shohei Nagai , Shailesh N. Joshi , Hitoshi Fujioka , Danny J. Lohan , Hiroshi Ukegawa , Ercan Mehmet Dede
- Applicant: Toyota Motor Engineering & Manufacturing North America, Inc. , Toyota Jidosha Kabushiki Kaisha
- Applicant Address: US TX Plano; JP Toyota Aichi-ken
- Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.,Toyota Jidosha Kabushiki Kaisha
- Current Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.,Toyota Jidosha Kabushiki Kaisha
- Current Assignee Address: US TX Plano; JP Toyota Aichi-ken
- Agency: Dinsmore & Shohl LLP
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A cold plate includes a first cooling surface comprising a first cooling structure bonded to an inner surface of the first cooling surface, a second cooling surface comprising a second cooling structure bonded to an inner surface of the second cooling surface, a manifold comprising an internal cavity defined by a first length, a first width, and a first height, and a flow divider defined by a second length, a second width, and a second height. The manifold is enclosed by the first cooling surface and the second cooling surface on opposing surfaces of the manifold separated by the first height. The flow divider is positioned within the internal cavity of the manifold. The flow divider supports and separates the first cooling structure and the second cooling structure by a portion of the second height of the flow divider.
Public/Granted literature
- US20220142017A1 DOUBLE-SIDED HYBRID COOLING OF PCB EMBEDDED POWER ELECTRONICS AND CAPACITORS Public/Granted day:2022-05-05
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