Invention Grant
- Patent Title: Optical modulator carrier assembly and optical module
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Application No.: US16847836Application Date: 2020-04-14
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Publication No.: US11604370B2Publication Date: 2023-03-14
- Inventor: Masahiro Hirayama
- Applicant: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Applicant Address: JP Yokohama
- Assignee: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Current Assignee: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Current Assignee Address: JP Yokohama
- Agency: Oliff PLC
- Priority: JPJP2019-077601 20190416
- Main IPC: G02F1/015
- IPC: G02F1/015 ; H01S5/026 ; G02B6/42 ; H01S5/00

Abstract:
An optical modulator carrier assembly includes a optical modulator, a transmission line substrate, a first via, a second via and a wire having an inductor component provided on a second surface of the transmission line substrate, and electrically connecting between the another end of the first via and the another end of the second via. The one end of the first via, the cathode electrode pad, the terminating resistor, the one end of the second via are arranged on the in this order.
Public/Granted literature
- US20200333639A1 OPTICAL MODULATOR CARRIER ASSEMBLY AND OPTICAL MODULE Public/Granted day:2020-10-22
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