Invention Grant
- Patent Title: Coil component
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Application No.: US17072679Application Date: 2020-10-16
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Publication No.: US11605494B2Publication Date: 2023-03-14
- Inventor: Syun Ashizawa , Masato Otsuka , Hanako Yoshino , Toshio Tomonari , Kohei Wada
- Applicant: TDK Corporation
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Young Law Firm, P.C.
- Priority: JPJP2017-207382 20171026
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/32 ; H01F5/04 ; H01F5/00

Abstract:
Disclosed herein is a coil component that includes an insulating substrate, a first coil part formed on the first surface of the insulating substrate, and a second coil part formed on the second surface of the insulating substrate. At least an innermost turn of the first coil part is radially separated by spiral-shaped slits into three or more conductor parts. At least an innermost turn of the second coil part is radially separated by spiral-shaped slits into three or more conductor parts. Inner peripheral ends of respective innermost to outermost conductor parts of the three or more conductor parts of the first coil part are connected to inner peripheral ends of the respective outermost to innermost conductor parts of the three or more conductor parts of the second coil part.
Public/Granted literature
- US20210035729A1 COIL COMPONENT Public/Granted day:2021-02-04
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