Invention Grant
- Patent Title: Methods and systems for cleaning high aspect ratio structures
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Application No.: US17025669Application Date: 2020-09-18
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Publication No.: US11605544B2Publication Date: 2023-03-14
- Inventor: Schubert S. Chu , Errol Antonio C. Sanchez
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/02

Abstract:
Embodiments of the present disclosure generally relate to methods and systems for cleaning a surface of a substrate. In an embodiment, a method of processing a substrate is provided. The method includes introducing a substrate to a processing volume of a processing chamber by positioning the substrate on a substrate support. The method further includes flowing a first process gas into the processing volume, the first process gas comprising HF, flowing a second process gas into the processing volume, the second process gas comprising pyridine, pyrrole, aniline, or a combination thereof, and exposing the substrate to the first process gas and the second process gas to remove oxide from the substrate under oxide removal conditions. In another embodiment, a system is provided that includes a processing chamber to process a substrate, and a controller to cause a processing method to be performed in the processing chamber.
Public/Granted literature
- US20220093418A1 METHODS AND SYSTEMS FOR CLEANING HIGH ASPECT RATIO STRUCTURES Public/Granted day:2022-03-24
Information query
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