Invention Grant
- Patent Title: Chuck assembly, semiconductor device fabricating apparatus including the same, and method of fabricating semiconductor device
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Application No.: US17408437Application Date: 2021-08-22
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Publication No.: US11605551B2Publication Date: 2023-03-14
- Inventor: Youngjae Son , Guesuk Lee , Taemin Earmme , Hyeongyun Lee , Seungchul Han
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2021-0003903 20210112
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/67

Abstract:
Disclosed are chuck assemblies, semiconductor device fabricating apparatuses, and methods of fabricating semiconductor devices. The chuck assembly comprises a chuck base including lower and upper bases, a ceramic plate on the upper base, an edge ring that surrounds the ceramic plate, a ground ring that surrounds an outer sidewall of the edge ring on an edge portion of the lower base, a coupling ring between the ground ring and the upper base and between the edge ring and the edge portion of the lower base, an upper heat sink between the coupling ring and the edge ring, and a sidewall heat sink between the coupling ring and the ground ring and between the coupling ring and the upper base.
Public/Granted literature
Information query
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