- Patent Title: Backside metal removal die singulation systems and related methods
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Application No.: US17445632Application Date: 2021-08-23
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Publication No.: US11605561B2Publication Date: 2023-03-14
- Inventor: Michael J. Seddon
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: Adam R. Stephenson, LTD.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/78 ; H01L21/66 ; H01L21/268 ; H01L21/3205 ; H01L21/3065 ; H01L21/324 ; H01L23/544 ; H01L21/3213

Abstract:
Implementations of methods of singulating a plurality of die included in a substrate may include forming a groove through a backside metal layer through laser ablating a backside metal layer at a die street of a substrate and singulating a plurality of die included in the substrate through removing substrate material of the substrate in the die street.
Public/Granted literature
- US20210384077A1 BACKSIDE METAL REMOVAL DIE SINGULATION SYSTEMS AND RELATED METHODS Public/Granted day:2021-12-09
Information query
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