Invention Grant
- Patent Title: Reconstituted wafer including integrated circuit die mechanically interlocked with mold material
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Application No.: US17017196Application Date: 2020-09-10
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Publication No.: US11605570B2Publication Date: 2023-03-14
- Inventor: Richard Korneisel , Nathaniel P. Wyckoff , Brandon C. Hamilton , Bret W. Simon , Jacob R. Mauermann
- Applicant: Rockwell Collins, Inc.
- Applicant Address: US IA Cedar Rapids
- Assignee: Rockwell Collins, Inc.
- Current Assignee: Rockwell Collins, Inc.
- Current Assignee Address: US IA Cedar Rapids
- Agency: Suiter Swantz pc llo
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L21/56
Abstract:
A system and method. The system may include an integrated circuit (IC) die. The IC die may have two faces and sides. The system may further include mold material. The mold material may surround at least the sides of the IC die. The IC die may be mechanically interlocked with the mold material.
Public/Granted literature
- US20220077016A1 RECONSTITUTED WAFER INCLUDING INTEGRATED CIRCUIT DIE MECHANICALLY INTERLOCKED WITH MOLD MATERIAL Public/Granted day:2022-03-10
Information query
IPC分类:
