A semiconductor device includes a substrate, an electrical conductor and a passivation layer. The substrate includes a first surface. The electric conductor is over the first surface of the substrate. The passivation layer is over the first surface of the substrate. The passivation layer includes a first part and a second part. In some embodiments, the first part is in contact with an edge of the electrical conductor, the second part is connected to the first part and apart from the edge of the electrical conductor, and the first part of the passivation layer has curved surface.