- Patent Title: Semiconductor device package and method of manufacturing the same
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Application No.: US16852256Application Date: 2020-04-17
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Publication No.: US11605598B2Publication Date: 2023-03-14
- Inventor: Wei Da Lin , Meng-Jen Wang , Hung Chen Kuo , Wen Jin Huang
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L21/56 ; H01L23/31 ; H01L23/04 ; H01L21/3213
Abstract:
A semiconductor device package includes a substrate having a surface, a conductive element disposed on the surface of the substrate, and an encapsulant disposed on the surface of the substrate and covering the conductive element. The conductive element has an upper surface facing away from the substrate and exposed from the encapsulant. Further, a roughness of the upper surface of the conductive element is greater than a roughness of a side surface of the conductive element.
Public/Granted literature
- US20210327822A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-10-21
Information query
IPC分类:
