Invention Grant
- Patent Title: Systems and methods for protecting a semiconductor device
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Application No.: US17337905Application Date: 2021-06-03
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Publication No.: US11605627B2Publication Date: 2023-03-14
- Inventor: Kuo-Yu Chou , Shang-Fu Yeh , Yi-Ping Chao , Chih-Lin Lee
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsinchu
- Agency: Jones Day
- Main IPC: H01L27/02
- IPC: H01L27/02
Abstract:
Circuits and methods for protecting a device are provided. A first device to be protected includes a gate dielectric of a first thickness. A second device includes a gate dielectric of a second thickness that is less than the first thickness. A gate is shared by the first device and the second device.
Public/Granted literature
- US20210288045A1 Systems and Methods for Protecting a Semiconductor Device Public/Granted day:2021-09-16
Information query
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