Invention Grant
- Patent Title: Method of manufacturing an integrated circuit comprising a capacitive element
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Application No.: US17165013Application Date: 2021-02-02
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Publication No.: US11605702B2Publication Date: 2023-03-14
- Inventor: Abderrezak Marzaki
- Applicant: STMicroelectronics (Rousset) SAS
- Applicant Address: FR Rousset
- Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee Address: FR Rousset
- Agency: Crowe & Dunlevy
- Priority: FR1853778 20180502
- Main IPC: H01L27/11517
- IPC: H01L27/11517 ; H01L29/06 ; H01L27/06 ; H01L27/07 ; H01L49/02 ; H01L27/10 ; H01L27/08

Abstract:
A capacitive element of an integrated circuit includes first and second electrodes. The first electrode is formed by a first electrically conductive layer located above a semiconductor well doped with a first conductivity type. The second electrode is formed by a second electrically conductive layer located above the first electrically conductive layer of the semiconductor well. The second electrode is further formed by a doped surface region within the semiconductor well that is heavily doped with a second conductivity type opposite the first conductivity type, wherein the doped surface region is located under the first electrically conductive layer. An inter-electrode dielectric area electrically separates the first electrode and the second electrode.
Public/Granted literature
- US20210159308A1 INTEGRATED CIRCUIT COMPRISING A CAPACITIVE ELEMENT, AND MANUFACTURING METHOD Public/Granted day:2021-05-27
Information query
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