Invention Grant
- Patent Title: Nitride semiconductor substrate and method of manufacturing the same
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Application No.: US17095195Application Date: 2020-11-11
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Publication No.: US11605716B2Publication Date: 2023-03-14
- Inventor: Hiroshi Oishi , Jun Komiyama , Yoshihisa Abe , Kenichi Eriguchi
- Applicant: CoorsTek KK
- Applicant Address: JP Tokyo
- Assignee: CoorsTek KK
- Current Assignee: CoorsTek KK
- Current Assignee Address: JP Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JPJP2019-227167 20191217,JPJP2019-232290 20191224
- Main IPC: H01L29/207
- IPC: H01L29/207 ; H01L29/20 ; H01L21/02 ; H01L29/06 ; H01L29/778 ; H01L29/267

Abstract:
The present invention provides a nitride semiconductor substrate suitable for a high frequency device. The nitride semiconductor substrate has a substrate, a buffer layer made of group 13 nitride semiconductors, and an active layer made of group 13 nitride semiconductors in this order, wherein the substrate is composed of a first substrate made of polycrystalline aluminum nitride, and a second substrate made of Si single crystal having a specific resistance of 100 Ω·cm or more, formed on the first substrate, the average particle size of AlN constituting the first substrate is 3 to 9 μm, and preferably, the second substrate grown by the MCZ method has an oxygen concentration of 1E+18 to 9E+18 atoms/cm3 and a specific resistance of 100 to 1000 Ω·cm.
Public/Granted literature
- US20210184004A1 NITRIDE SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-06-17
Information query
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