Invention Grant
- Patent Title: Semiconductor light-emitting element
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Application No.: US17369493Application Date: 2021-07-07
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Publication No.: US11605753B2Publication Date: 2023-03-14
- Inventor: Tetsu Hiko Inazu
- Applicant: NIKKISO CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: NIKKISO CO., LTD.
- Current Assignee: NIKKISO CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: JPJP2021-069026 20210415
- Main IPC: H01L33/32
- IPC: H01L33/32 ; H01L33/06 ; H01L33/00

Abstract:
A semiconductor light-emitting element includes: an n-type contact layer; an n-side inserted layer provided on a first upper surface of the n-type contact layer, made of an AlGaN-based semiconductor material, and having a thickness equal to or smaller than 5 nm; an n-type clad layer provided on the n-side inserted layer; an active layer provided on the n-type clad layer and including a well layer and a barrier layer made of an AlGaN-based semiconductor material; a p-type clad layer provided on the active layer; a p-side inserted layer provided on the p-type clad layer, made of an AlGaN-based semiconductor material, and having a thickness equal to or smaller than 5 nm; and a p-type contact layer provided on the p-side inserted layer. An AlN composition of each of the n-side and p-side inserted layers is higher than an AlN composition of the barrier layer.
Public/Granted literature
- US20220336693A1 SEMICONDUCTOR LIGHT-EMITTING ELEMENT Public/Granted day:2022-10-20
Information query
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