Invention Grant
- Patent Title: Light emitting diode package
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Application No.: US16943144Application Date: 2020-07-30
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Publication No.: US11605763B2Publication Date: 2023-03-14
- Inventor: Myung Jin Kim , Kwang Yong Oh
- Applicant: SEOUL SEMICONDUCTOR CO., LTD.
- Applicant Address: KR Gyeonggi-do
- Assignee: SEOUL SEMICONDUCTOR CO., LTD.
- Current Assignee: SEOUL SEMICONDUCTOR CO., LTD.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Perkins Coie LLP
- Priority: KR10-2019-0001181 20190104
- Main IPC: H01L33/56
- IPC: H01L33/56 ; H01L33/50
Abstract:
A light emitting diode package is disclosed. The light emitting diode package includes a light emitting diode chip emitting light and a light transmissive member. The light transmissive member covers at least an upper surface of the light emitting diode chip and includes a light transmissive resin and reinforcing fillers. The reinforcing fillers have at least two side surfaces having different lengths and are dispersed in the light transmissive resin.
Information query
IPC分类:
