Invention Grant
- Patent Title: LED module
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Application No.: US16556896Application Date: 2019-08-30
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Publication No.: US11605765B2Publication Date: 2023-03-14
- Inventor: Masahiko Kobayakawa , Tomoichiro Toyama
- Applicant: Rohm Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2010-090712 20100409
- Main IPC: H01L33/60
- IPC: H01L33/60 ; H01L25/075 ; H01L33/62 ; H01L33/48 ; H01L23/00

Abstract:
An LED module according to the present invention includes an LED unit 2 and a case 1, where the LED unit includes an LED chip 21, and the case 1 includes a main body 11 made of a ceramic material and a pad 12a on which the LED unit 2 is mounted. The outer edge 121a of the pad 12a is positioned inward of the outer edge 2a of the LED unit 2 as viewed in plan. These arrangements prevent the light emission amount of the LED module A1 from reducing with time.
Public/Granted literature
- US20190386190A1 LED MODULE Public/Granted day:2019-12-19
Information query
IPC分类: