Invention Grant
- Patent Title: Method of manufacturing formed body for electrode
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Application No.: US17563092Application Date: 2021-12-28
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Publication No.: US11605805B2Publication Date: 2023-03-14
- Inventor: Eijiro Iwase , Akihito Fukunaga , Takehiko Nakayama , Koji Tonohara
- Applicant: FUJIFILM CORPORATION
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM CORPORATION
- Current Assignee: FUJIFILM CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Solaris Intellectual Property Group, PLLC
- Priority: JPJP2019-149867 20190819
- Main IPC: H01M4/04
- IPC: H01M4/04 ; H01M10/0525 ; H01M4/02 ; B05D1/26 ; B05C5/02 ; B29C41/28

Abstract:
A method of manufacturing a formed body for an electrode includes: preparing an electrode material; placing a shape retaining member having an rectangular tubular shape with one opening portion L thereof facing down, and supplying the electrode material into the shape retaining member from the other opening portion M thereof; and discharging the electrode material onto a support from the opening portion L while relatively moving the opening portion L and the support, to form a film, a bulk density D1 of the electrode material in the first step and a bulk density D2 of the electrode material at the opening portion L satisfying a relationship of D2/D1=1.1 to 30, and a width T1 of the opening portion L in a short side direction and a distance T2 between the end portion X of the opening portion L and the support satisfying a relationship of width T1>distance T2.
Public/Granted literature
- US20220123275A1 METHOD OF MANUFACTURING FORMED BODY FOR ELECTRODE Public/Granted day:2022-04-21
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