According to various embodiments of the present invention, an electronic device may comprise: a housing comprising a first surface, a second surface oriented in the direction opposite from the first surface, and a side surface surrounding a space between the first surface and the second surface; a conductive member for forming at least a portion of the side surface; a display seen through the first surface and including a first conductive layer; a printed circuit board disposed to be spaced apart from the display between the display and the second surface in the housing, and including a second conductive layer in which at least a portion thereof faces the first conductive layer; a third conductive layer spaced apart from the display and the printed circuit board, disposed between the first conductive layer and the second conductive layer, and facing the first conductive layer; a support structure comprising a non-conductive plate which is formed between the third conductive layer and the printed circuit board and in which at least a portion thereof is in contact with the third conductive layer; a conductive pattern extending between the third conductive layer and the non-conductive plate and electrically connected to the second conductive layer; and a wireless communication circuit electrically connected to the conductive member and configured to transmit and/or receive an RF signal. Other various embodiments may be possible.