A backplane connector includes a number of wafers. Each wafer includes a number of conductive terminals, a first metal shield and a second metal shield. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. Each conductive terminal has a contact portion. The first metal shield and the second metal shield respectively include a first extension portion and a second extension portion. The first extension portion and/or the second extension portion include a limiting structure for limiting the contact portion of the first ground terminal and/or the contact portion of the second ground terminal. Besides, in two adjacent wafers, the first extension portion of one wafer contacts the second extension portion of the other wafer through protruding tabs. As a result, the structural reliability of the backplane connector is improved.