Invention Grant
- Patent Title: Battery control system-in-package and method of fabricating the same
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Application No.: US17159729Application Date: 2021-01-27
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Publication No.: US11605959B2Publication Date: 2023-03-14
- Inventor: Hyuk Hwi Na , Ho Seok Hwang , Ja Guen Gu , Chi Sun Song , Seong Beom Park , Sun Ho Kim
- Applicant: ITM SEMICONDUCTOR CO., LTD.
- Applicant Address: KR Chungcheongbuk-do
- Assignee: ITM SEMICONDUCTOR CO., LTD.
- Current Assignee: ITM SEMICONDUCTOR CO., LTD.
- Current Assignee Address: KR Chungcheongbuk-do
- Agency: Mayer & Williams, PC
- Agent Stuart H. Mayer
- Priority: KR10-2020-0019898 20200218
- Main IPC: H02J7/04
- IPC: H02J7/04 ; H02J7/00 ; H02J7/02 ; H01L25/00 ; H01L25/065 ; H01L23/495
Abstract:
Provided is a battery control system-in-package including a package substrate, a wireless charger integrated circuit (IC) module mounted on the package substrate, a wired charger IC module mounted on the package substrate, a battery protection IC module mounted on the package substrate, and a single mold provided on the package substrate to encapsulate the wireless charger IC module, the wired charger IC module, and the battery protection IC module.
Public/Granted literature
- US20210257846A1 BATTERY CONTROL SYSTEM-IN-PACKAGE AND METHOD OF FABRICATING THE SAME Public/Granted day:2021-08-19
Information query
