Invention Grant
- Patent Title: Body tie optimization for stacked transistor amplifier
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Application No.: US17021878Application Date: 2020-09-15
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Publication No.: US11606065B2Publication Date: 2023-03-14
- Inventor: Simon Edward Willard , Chris Olson , Tero Tapio Ranta
- Applicant: pSemi Corporation
- Applicant Address: US CA San Diego
- Assignee: pSemi Corporation
- Current Assignee: pSemi Corporation
- Current Assignee Address: US CA San Diego
- Agency: Jaquez Land Greenhaus & McFarland LLP
- Agent Alessandro Steinfl, Esq.
- Main IPC: H03F1/22
- IPC: H03F1/22 ; H03F1/02 ; H01L49/02 ; H01L21/84 ; H01L27/12 ; H01L29/08 ; H01L29/10 ; H01L27/06 ; H03F3/193 ; H03F1/52 ; H03F3/195 ; H03F3/21

Abstract:
A transistor stack can include a combination of floating and body tied devices. Improved performance of the RF amplifier can be obtained by using a single body tied device as the input transistor of the stack, or as the output transistor of the stack, while other transistors of the stack are floating transistors. Transient response of the RF amplifier can be improved by using all body tied devices in the stack.
Public/Granted literature
- US20210067096A1 Body Tie Optimization for Stacked Transistor Amplifier Public/Granted day:2021-03-04
Information query
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