An electronic apparatus includes a substrate having a first surface on which a semiconductor element is mounted and a holding member configured to adhere to a second surface of the substrate which is a surface opposite to the first surface and to hold the substrate. The second surface of the substrate includes a first region to which the holding member is fixed via an adhesive, a second region in which a conductive portion that conducts heat of the semiconductor element from the first surface to the second surface of the substrate is disposed, and a third region at which a portion of the holding member and the substrate come into contact with each other. The second region is provided between the first region and the third region in a plane direction of the second surface.