Invention Grant
- Patent Title: Component analyzing apparatus and component analyzing method, and impedance measuring apparatus
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Application No.: US16878192Application Date: 2020-05-19
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Publication No.: US11607147B2Publication Date: 2023-03-21
- Inventor: Kun Sun Eom , Sung Hyun Nam , Moon Seong Park , Yun S Park , Myoung Hoon Jung
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2020-0006139 20200116
- Main IPC: A61B5/0537
- IPC: A61B5/0537 ; A61B5/0531 ; A61B5/145 ; A61B5/00

Abstract:
A component analyzing apparatus is provided. The component analyzing apparatus includes: an impedance measurer including: a plurality of electrodes having an electrode width that is determined based on an effective measurement depth for analyzing a component of an analyte and a gap between two electrodes among the plurality of electrodes, and an electrode controller configured to apply a first current to a first electrode and a second electrode among the plurality of electrodes and configured to measure impedance based on a voltage between a third electrode and a fourth electrode; and a processor configured to analyze the component of the analyte based on the impedance measured by the electrode controller.
Public/Granted literature
- US20210219864A1 COMPONENT ANALYZING APPARATUS AND COMPONENT ANALYZING METHOD, AND IMPEDANCE MEASURING APPARATUS Public/Granted day:2021-07-22
Information query
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