Invention Grant
- Patent Title: Locking mechanism for tie down locking device
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Application No.: US17332389Application Date: 2021-05-27
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Publication No.: US11607985B2Publication Date: 2023-03-21
- Inventor: Nicholas Deplaris
- Applicant: Nicholas Deplaris
- Applicant Address: US IL Oak Lawn
- Assignee: Nicholas Deplaris
- Current Assignee: Nicholas Deplaris
- Current Assignee Address: US IL Oak Lawn
- Agency: K&L Gates LLP
- Main IPC: B60P7/08
- IPC: B60P7/08

Abstract:
A tie down locking mechanism includes a first plate including a first cavity and a first aperture, a second plate including a second cavity and a second aperture, and a spring mechanism that biases the first and second plates into a first position and that moves the first and second plates into a second position when the bias is overcome with an application of force. Each cavity includes an interior portion connected to an opening on a perimeter of the respective plate. When the first and second plates are in the first position, the openings of the first and second cavities are aligned and the apertures are not aligned. When the first and second plates are in the second position, the openings of the first and second cavities are not aligned and the apertures are aligned.
Public/Granted literature
- US20220055522A1 LOCKING MECHANISM FOR TIE DOWN LOCKING DEVICE Public/Granted day:2022-02-24
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