Invention Grant
- Patent Title: Sound-absorbing material
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Application No.: US16575386Application Date: 2019-09-19
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Publication No.: US11608014B2Publication Date: 2023-03-21
- Inventor: Daisuke Suzuki , Yasutaka Ito , Tomoyoshi Nakamura , Koji Ohshika
- Applicant: IBIDEN CO., LTD.
- Applicant Address: JP Ogaki
- Assignee: IBIDEN CO., LTD.
- Current Assignee: IBIDEN CO., LTD.
- Current Assignee Address: JP Ogaki
- Agency: Mori & Ward, LLP
- Priority: JPJP2017-059649 20170324
- Main IPC: B32B3/24
- IPC: B32B3/24 ; B60R13/08 ; B32B5/06 ; B32B3/26

Abstract:
The present invention aims to provide a sound-absorbing material having sound absorption performance with an average sound absorption coefficient of 0.65 or more in the frequency domain of 800 to 2000 Hz. The present invention relates to a sound-absorbing material including: a fiber layer including a plurality of holes open to a surface thereof and having a thickness of 3 mm or more; and an inorganic material layer formed on the surface of the fiber layer, the holes being blind holes each penetrating through the inorganic material layer and having a bottom inside the fiber layer.
Public/Granted literature
- US20200010028A1 SOUND-ABSORBING MATERIAL Public/Granted day:2020-01-09
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