Invention Grant
- Patent Title: Offset flange floor panel connection system
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Application No.: US16933991Application Date: 2020-07-20
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Publication No.: US11608155B2Publication Date: 2023-03-21
- Inventor: Christopher J. Mills , Emily Yang , Michael Patrick Durbin
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Kolisch Hartwell, P.C.
- Main IPC: B64C1/18
- IPC: B64C1/18 ; B64D11/06

Abstract:
A floor panel connection system for attaching a floor panel to an airframe is disclosed. The connection system includes an offset flange insert comprising a base portion, a flange portion, and an interconnect portion. The base portion of the insert is configured to be received in a hole in an edge region of the floor panel and includes an opening that is sized to receive a fastener. The interconnect portion extends laterally from the base portion such that when the edge portion of the floor panel is overlapping a lateral edge portion of the airframe, the flange portion of the insert is beyond the lateral edge portion. The flange portion is also configured to be bonded to a bottom surface of the floor panel beyond the lateral edge portion of the airframe.
Public/Granted literature
- US20200346734A1 OFFSET FLANGE FLOOR PANEL CONNECTION SYSTEM Public/Granted day:2020-11-05
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